The Footwear Technology Centre of La Rioja offers the expertise of it' R&D departments, along with more than 110 associated entities of the textile and footwear industry, and it's state-of-the-art laboratories and workshops. We also carry out R&D projects aimed for Smart Manufacturing and Advanced Industry, developing technology that allows resiliency, competitiveness, enhancing processes and assuring quality. With expertise in Additive Manufacturing, prototyping, sensing, IoT, smart electronics
Pilot line(s) for 2D materials-based devices (RIA)
TOPIC ID: HORIZON-CL4-2024-DIGITAL-EMERGING-01-31
Programme: Horizon Europe Framework Programme (HORIZON)
Call: Digital and emerging technologies for competitiveness and fit for the Green Deal (HORIZON-CL4-2024-DIGITAL-EMERGING-01-CNECT)
Projects are expected to contribute to the following outcomes:
Broadly accessible pilot line(s) fostering the creation of electronic and photonic devices and systems (co-)integrating two-Dimensional Materials (2DM).
Significant progress towards the adoption of the 2DM in the silicon and semi-conductor arena by allowing the production of new (co-)integrated devices and systems in a quality controlled way.
Proposals shall continue the efforts started in the 2D experimental Pilot Line of the Graphene Flagship and build on the IP developed therein, to establish a 2DM pilot line(s), where European companies, research centres and academic institutions, can produce on a pilot scale novel electronic and/or photonic devices and systems integrating 2DM.
Proposals should focus on the (co-)integration of 2DM with established technologies such as CMOS integration and heterogeneous integration.
Proposal should include supply of standard semiconductor technologies such as CMOS, ASICs, planarized waveguides already adapted/optimized for 2DM co-integration.
Proposals should specify targeted added value(s) against current technologies of the integrated devices and systems. Proposals should consider the following TRLs: for Electronics applications starting TRL 3 with ending TRL 5 and for photonics applications starting TRL 3-4 and ending TRL 5-6.
Multidisciplinary research and innovation activities should address all of the following:
Building the toolkit and design modules necessary for creating prototype devices and systems, characterise and assess their performance and their ability to cover the device requirements of the targeted applications.
Process characterisation and monitoring to control and guarantee quality of relevant device parameters and to allow yield predictions of the integrated devices.
Adaptation of standard semiconductor technologies including passivation schemes, strategies to align devices over different technologies, modules to contact the 2D devices with the periphery, optimized planarization strategies and packaging services.
Reliability and packaging requirements;
Implementing multiple wafer runs or other offering to best cover business opportunities;
Defining a sustainable model of functioning beyond the project lifetime and include activities preparing for the later transfer of the pilot line to an industrial production environment; examples of such activities include addressing relevant cost issues and market perspectives, potential business partners, etc.
Proposals submitted under this topic should include a business case and exploitation strategy, as outlined in the introduction to this Destination.
Research should build on existing standards or contribute to standardisation. Interoperability for data sharing should be addressed.