Securing Microelectronics Supply Chain in Singapore and Malaysia

Last update: Apr 18, 2024 Last update: 18 Apr, 2024

Details

Location:

Malaysia, Singapore

Funding agency:

United States Department of State (USA)

Contracting Authority: Bureau of International Security and Nonproliferation

Contracting Authority Type:Government / Public Sector

Status:Open

Budget:N/A

Award ceiling:USD 493,339

Award floor:USD 493,339

Sector:Security

Languages:English

Eligible applicants:NGOs / Nonprofit Organisations, Government / Public Bodies, Academic Institutions, Private Sector

Eligible nationalities:

Worldwide

Date posted:17 Apr, 2024

Attachments • 2

Description

General Information Document Type: Grants Notice Funding Opportunity Number: DFOP0013975 Funding Opportunity Title: Securing Microelectronics Supply Chain in Singapore and Malaysia Opportunity Category: Discretionary Opportunity Category Explanation: Fund

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Afghanistan, Bangladesh, Bhutan, Brunei, Cambodia, China, India, Indonesia, Japan, Laos, Malaysia, Maldives, Myanmar, Nepal, Pakistan, Philippines, Singapore, South Korea, Sri Lanka, Taiwan, Thailand, Timor-Leste, Vietnam