Share
Print
Call updates
Nov 5, 2021 3:52:01 PM
Submissions to call HORIZON-CL4-2021-DIGITAL-EMERGING-01
A total of 327 proposals has been submitted to call HORIZON-CL4-2021-DIGITAL-EMERGING-01, which closed on 21 October 2021. These proposals, of which the evaluation will be organized over the coming weeks and months, were submitted to the following topics:
HORIZON-CL4-2021-DIGITAL-EMERGING-01-07 - Advanced Photonic Integrated Circuits (Photonics Partnership) (RIA)
43 proposals (indicative budget 39 EUR million)
Oct 4, 2021 2:14:03 PM
Please note that the 'Other annexes' box has been added to the submission system.
However, please keep in mind that this box should not be used for proposals submitted to this topic, because it is reserved for the description of the use of financial support to third parties, not allowed for this topic. Any information uploaded in that box will be disregarded.
Jun 22, 2021 3:40:31 PM
The submission session is now available for: HORIZON-CL4-2021-DIGITAL-EMERGING-01-07(HORIZON-RIA)
Advanced Photonic Integrated Circuits (Photonics Partnership) (RIA)
TOPIC ID: HORIZON-CL4-2021-DIGITAL-EMERGING-01-07
Programme: Horizon Europe Framework Programme (HORIZON)
Call: Digital and emerging technologies for competitiveness and fit for the green deal (HORIZON-CL4-2021-DIGITAL-EMERGING-01)
Type of action: HORIZON-RIA HORIZON Research and Innovation Actions
Type of MGA: HORIZON Action Grant Budget-Based [HORIZON-AG]
Deadline model: single-stage
Opening date: 22 June 2021
Deadline date: 21 October 2021 17:00:00 Brussels time
Topic description
ExpectedOutcome:
Proposal results are expected to contribute to the following expected outcomes:
Scope:
Evolving photonic integration is opening up a wealth of opportunities in many application areas by enhancing functionality and spectral coverage, facilitating new applications in biomedical, environmental and industrial fields, making devices more power-efficient and bringing ground-breaking technologies within reach of entrepreneurial SMEs.
The increasingly sophisticated requirements need new paradigms, capable of extending the functionalities of optical components through design, integration, fabrication, assembly and packaging techniques including the co-integration of photonic and electronic components. These need to be augmented with new functions and performance enhancements, requiring in many cases the development of new materials and innovative device structures.
Challenges are for example in mastering epitaxial material growth and processing on large wafers with improved quality, uniformity and very low defect densities, broadband (“white”) light sources and high sensitivity photodetectors (including arrays) and high-efficiency semiconductor lasers across many wavelength bands, capable of withstanding high temperatures (>85°C) depending on the intended application. Incorporation of new building blocks such as magneto-optic elements for non-reciprocal functionality (e.g. optical isolation) could also be included.
Proposals should demonstrate the developed integration technologies in at least two application oriented use cases and establish integration platforms, which help potential user companies with their uptake.
In this topic the integration of the gender dimension (sex and gender analysis) in research and innovation content is not a mandatory requirement.
This topic implements the co-programmed European Partnership for Photonics.
Specific Topic Conditions:
Activities are expected to start at TRL 2-3 and achieve TRL 4-5 by the end of the project – see General Annex B.
Cross-cutting Priorities:
Co-programmed European Partnerships