Low TRL research in micro-electronics and integration technologies for industrial solutions (RIA)

Call updates

Jul 31, 2023 3:02:32 PM

EVALUATION results

Published: 07/12/2022

Deadline: 29/03/2023

Available budget: EUR 129 000 000

The results of the evaluation are as follows:

Number of proposals submitted (including proposals transferred from or to other calls): 97

Number of inadmissible proposals: 0

Number of ineligible proposals: 1

Number of above-threshold proposals: 75

Total budget requested for above-threshold proposals: EUR 316,536,982.98

We recently informed the applicants about the evaluation results for their proposals.

For questions, please contact the Research Enquiry Service.

Mar 31, 2023 10:54:28 AM

Call HORIZON-CL4-2023-DIGITAL-EMERGING-01-CNECT has closed on the 29 March 2023.

97 proposals have been submitted.

The breakdown per topic is:

HORIZON-CL4-2023-DIGITAL-EMERGING-01-11: 36 proposals

Evaluation results are expected to be communicated in July 2023.

Dec 8, 2022 11:28:13 AM

The submission session is now available for: HORIZON-CL4-2023-DIGITAL-EMERGING-01-11(HORIZON-RIA)

Low TRL research in micro-electronics and integration technologies for industrial solutions (RIA)

TOPIC ID: HORIZON-CL4-2023-DIGITAL-EMERGING-01-11

Programme: Horizon Europe Framework Programme (HORIZON)
Call: Digital and emerging technologies for competitiveness and fit for the Green Deal (HORIZON-CL4-2023-DIGITAL-EMERGING-01-CNECT)
Type of action: HORIZON-RIA HORIZON Research and Innovation Actions
Type of MGA: HORIZON Action Grant Budget-Based [HORIZON-AG]
Deadline model: single-stage
Opening date: 08 December 2022
Deadline date: 29 March 2023 17:00:00 Brussels time

ExpectedOutcome:
Projects are expected to contribute to the following outcomes:

Innovative semiconductor and micro-nanoelectronic systems design concepts supporting very low energy consumption, integrated security, connectivity, sensing, actuating and embedded functions suited to mixed analogue/RF and digital circuits.
Alternative[1] semiconductor manufacturing process technologies able to sustain in the mid- and long-terms the fast pace evolution of device performance, miniaturisation and cost, while reducing environmental footprint.
Very advanced packaging solutions aiming at extreme miniaturisation and integration of multiple functions such as communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration
Scope:
Proposals should:

Address low-TRL research with high potential not yet demonstrated in the design, fabrication process and/or packaging segments of the micro-nano-electronics and integration technologies value chain.
Innovation focus can be on materials, physic concepts, device architecture or integration technologies.
Provide a projection of the expected gains and main figures of merit of the proposed approaches.
Multi-disciplinary research activities should be address along part of the value chain from materials, processes, equipment, metrology, back-end processing to packaging, integration and tests.

International cooperation is encouraged, especially with leading semiconductor countries (e.g. Japan, South Korea, Taiwan) in support of EU policies (and outcome of the CSA on Int’ cooperation in SC).

In this topic the integration of the gender dimension (sex and gender analysis) in research and innovation content is not a mandatory requirement.

Specific Topic Conditions:
Activities are expected to start at TRL 1-2 and achieve TRL 3-4 by the end of the project – see General Annex B.

[1]Alternative to mainstream Silicon CMOS technologies