European Commission Directorate-General for International Partnerships (EuropeAid HQ)

DIGITAL-Chips-2023-SG-CPL-3 Pilot line on advanced Packaging and Heterogenous Integration

Last update: Dec 4, 2023 Last update: Dec 4, 2023

Details

Location:EU 27
EU 27
Contracting authority type:Development Institution
Status:Forecast
Budget: EUR 30,000,000
Award ceiling:N/A
Award floor:N/A
Sector:Information & Communication Technology, Science & Innovation, Research
Languages:English
Eligible applicants:Unrestricted / Unspecified
Eligible citizenships:EU 27
EU 27
Date posted: Dec 4, 2023

Attachments 0

Description

DIGITAL-Chips-2023-SG-CPL-3 Pilot line on advanced Packaging and Heterogenous Integration DIGITAL-Chips-2023-SG-CPL-3 Programme: Digital Europe Programme (DIGITAL)Call: DIGITAL-Chips-2023-SG-CPL Operational activities of the pilot line (DIGITAL-Chips-2023
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