Horizon 2020 (2014 - 2020)

Micro- and nanoelectronics technologies

Last update: Oct 22, 2021 Last update: Oct 22, 2021

Details

Location:EU 27, SwitzerlandEU 27, Switzerland
Contracting Authority Type:Development Institution
Status:Awarded
Budget: EUR 23,000,000
Award ceiling:N/A
Award floor:N/A
Sector:Information & Communication Technology, Science & Innovation, Mechanical Engineering
Eligible applicants:Unrestricted / Unspecified
Eligible nationalities:Afghanistan, Albania, Algeria, A ... See more Afghanistan, Albania, Algeria, American Samoa, Angola, Anguilla, Argentina, Armenia, Aruba, Austria, Azerbaijan, Azores, Bangladesh, Belarus, Belgium, Belize, Benin, Bermuda, Bhutan, Bolivia, Bosnia and Herzegovina, Botswana, British Virgin Islands, Bulgaria, Burkina Faso, Burundi, Cambodia, Cameroon, Canary Islands, Cape Verde, Caribbean Netherlands, Cayman Islands, Central African Republic, Chad, Chile, Colombia, Comoros, Congo, Costa Rica, Cote d'Ivoire, Croatia, Cuba, Cyprus, Czech Republic, Dem. Rep. Congo, Denmark, Djibouti, Dominica, Commonwealth of, Dominican Republic, Ecuador, Egypt, El Salvador, Eritrea, Estonia, Eswatini (Swaziland), Ethiopia, Falkland Islands, Faroe Islands, Fiji, Finland, France, French Polynesia, French Southern Territory, Gabon, Gambia, Georgia, Germany, Ghana, Greece, Greenland, Grenada, Guatemala, Guinea, Guinea-Bissau, Guyana, Haiti, Honduras, Hungary, Iceland, Indonesia, Iran, Iraq, Ireland, Israel, Italy, Jamaica, Jordan, Kazakhstan, Kenya, Kiribati, Kosovo, Kyrgyzstan, Laos, Latvia, Lebanon, Lesotho, Liberia, Libya, Lithuania, Luxembourg, Madagascar, Malawi, Malaysia, Maldives, Mali, Malta, Marshall Islands, Mauritania, Mauritius, Micronesia, Moldova, Mongolia, Montenegro, Montserrat, Morocco, Mozambique, Myanmar, Namibia, Nepal, Netherlands, New Caledonia, Nicaragua, Niger, Nigeria, North Korea, North Macedonia, Norway, Pakistan, Palau, Palestine / West Bank & Gaza, Panama, Papua New Guinea, Paraguay, Peru, Philippines, Pitcairn, Poland, Portugal, Romania, Rwanda, Saint Helena, Saint Kitts and Nevis, Saint Lucia, Saint Vincent and the Grenadines, Samoa, Sao Tome and Principe, Senegal, Serbia, Seychelles, Sierra Leone, Slovakia, Slovenia, Solomon Islands, Somalia, South Africa, South Sudan, Spain, Sri Lanka, St. Pierre and Miquelon, Sudan, Suriname, Sweden, Switzerland, Syria, Tajikistan, Tanzania, Thailand, Timor-Leste, Togo, Tonga, Tunisia, Turkey, Turkmenistan, Turks and Caicos, Tuvalu, Uganda, UK, Ukraine, Uruguay, Uzbekistan, Vanuatu, Venezuela, Vietnam, Wallis and Futuna, Yemen, Zambia, Zimbabwe
Date posted: Oct 15, 2015

Attachments 7

Description

Call updates:

11 August 2017 15:55

An overview of the evaluation results (called 'Flash Call Info') of the topics of the H2020-ICT_2017-1 call is now available under the section Topic conditions and documents - additional documents.

28 April 2017 12:46

The submission of proposals to the 18 topics of this H2020-ICT-2017 call closed on 25 April 2017. A total of 995 proposals were submitted in response to these topics. Please find below the breakdown for this topic and type of action: Topic ICT-31-2017

(RIA)- 43;

(IA)-6;

(CSA)-1;

TOTAL -50

16 January 2017 16:25

As of 1st January 2017, Switzerland is associated to the entire H2020 programme. In consequence, it is now also associated to this topic. In a nutshell this means that Swiss partners in a proposal are now on an equal footing with partners from EU Member States or other Associated Countries. For the details, please read this note.

08 December 2016 00:30

The submission session is now available for: ICT-31-2017(IA), ICT-31-2017(CSA), ICT-31-2017(RIA)


 TOPIC : Micro- and nanoelectronics technologies

Topic identifier: ICT-31-2017
Publication date: 14 October 2015

Types of action: CSA Coordination and support action,RIA Research and Innovation action,IA Innovation action
DeadlineModel:
Planned opening date:
single-stage
08 December 2016
Deadline: 25 April 2017 17:00:00

Time Zone : (Brussels time)
 
Topic Budget (EUR) - Year : 2016 Budget (EUR) - Year : 2017 Stages Opening date Deadline
ICT-31-2017 - CSA Coordination and support action   1,000,000 single-stage 08 December 2016 25 April 2017
ICT-31-2017 - RIA Research and Innovation action   19,000,000 single-stage 08 December 2016 25 April 2017
ICT-31-2017 - IA Innovation action   3,000,000 single-stage 08 December 2016 25 April 2017

  Horizon 2020 

Pillar: Industrial Leadership
Work Programme Year: H2020-2016-2017
Call : H2020-ICT-2016-2017
Topic Description
Specific Challenge:

While the state-of-the-art micro/nano-electronics technologies and their manufacturing are being further advanced towards market-readiness in the context of the ECSEL Joint Undertaking, it is essential to prepare for the future of the electronics industry the next wave of industry-relevant technologies to extend the limits (technological and/or economic) mainstream technologies will be facing in the medium term[1]. This is essential to maintain and increase Europe's longer-term capacity in the design and manufacturing of these technologies and to strengthen the competitiveness and market leadership of the many industries innovating through these technologies.

Scope:

a. Research and Innovation actions

The work must be in the scope of one of the following topics:

  • the development of new approaches to scale functional performance of information processing and storage substantially beyond the state-of-the-art technologies with a focus on ultra-low power and high performance. Work may address materials, processes, device and component architectures, system micro-architectures (processor and memory), security, design, modelling, simulation and nano-characterization, and must consider integration, systemability and manufacturability. Technologies exploiting the quantum effects in solid-state devices are also relevant. Advanced explorative technology development at TRL 2-3 is called for.
  • 3D sequential integration (at transistor scale) possibly mixed with 3D parallel integration (at circuit level) for system solutions to increase functionalities and capabilities. Work could address interconnects (intra-layer and vertical structures), design challenges (3D design kits and tools, power models and optimization), prototyping and test methods. Proposals at TRL 2-3 are called for.

International cooperation with clear EU industrial benefits may be considered preferably with nations that have substantial research in the area (e.g. Japan, South Korea, Taiwan, and the USA).

The Commission considers that proposals requesting a contribution from the EU of between EUR 2 and 4 million would allow this specific challenge to be addressed appropriately. Nonetheless, this does not preclude submission and selection of proposals requesting other amounts.

b. Innovation action[2]

In Equipment Assessment Experiments, suppliers of innovative high-tech equipment install, assess and validate their prototypes or products that have left the R&D phase in environments that are very close to real-life conditions in cooperation with end-user. Proposals at TRL 6-7 are called for.

The Commission considers that proposals requesting a contribution from the EU between EUR 1 and 2 million would allow this specific challenge to be addressed appropriately. Nonetheless, this does not preclude submission and selection of proposals requesting other amounts.

c. Coordination and Support actions

In view of promoting the attractiveness of careers in micro/nanoelectronics towards young people, a dedicated pan-European challenge event should be proposed to showcase the possibilities offered by state-of-the-art hardware technologies (similar to the European code week for software apps). The sustainability of this event should also be addressed.

The Commission considers that proposals requesting a contribution from the EU of about EUR 0.5 million would allow this specific challenge to be addressed appropriately. Nonetheless, this does not preclude submission and selection of proposals requesting other amounts.

Expected Impact:

Proposals should address the following impact criteria and provide metrics to measure and monitor success

a. Research and Innovation actions

The actions will aim at contributing to the future growth in Europe of the micro-/nanoelectronics and related industries.

  • The proposals must describe how the proposed developments of new/enabling technologies will contribute to the target of doubling the economic value of semiconductor component production in Europe within the next 10 years as set by the Electronics Leaders Group in their strategic roadmap[3] and implementation plan[4].
  • The proposals must outline a realistic roadmap for further progressing on the TRL range beyond the project timeframe and a concrete business perspective describing expected markets for the industrial partners and impact for European industry and society at large.

b. Innovation actions

  • Proposals should clearly demonstrate the route from assessment to first use of the equipment. The user requirements of the equipment to be assessed should represent significant improvements to existing equipment in terms of capability, precision, efficiency or other characteristics opening new avenues of deployment.

c. Coordination and Support actions

  • The actions will raise the awareness of young people for the potential offered by a technological career thereby attracting more students to the field.
  • The proposed event should have ambitious targets in the number of participations (reach-out to thousands of students) and the scope of the activities (designs and prototypes) to be showcased.

[1]Graphene is covered by the eponym FET Flagship initiative

[2]Access actions (including EuroPractice-type actions) are addressed under ICT-4

[3]https://ec.europa.eu/digital-agenda/en/electronics-roadmap-europe

[4]https://ec.europa.eu/digital-agenda/en/news/european-industrial-strategic-roadmap-micro-and-nano-electronic-components-and-systems-0

 

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