Serces to enhance the innovation management capacity of SMEs in the macro-region 1 in Romania
- Funding agency:
- Horizon 2020
- Status:
- awarded
- Location:
- Romania
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Innovative cooling system for embedded power electronics
Details
Location:
EU 27
Funding agency:
Grantmaking entity type:
Development Institution
Status:
Awarded
Budget:
N/A
Award ceiling:
N/A
Award floor:
N/A
Sector:
Energy, Heating & Cooling systems, Transport
Eligible applicants:
Unrestricted / Unspecified
Eligible applicant countries:
EU 27, Albania, Armenia, Bosnia and Herzegovina, Georgia, Iceland, Israel, Moldova, Montenegro, North Macedonia, Norway, Serbia, Switzerland, Tunisia, Türkiye, Ukraine
Date posted:
Jun 22, 2016
Description
Call updates:
06 September 2016 16:14
On 6th September the third release of the "Questions & Answers" document was published on this call web site. It is available in the "Additional Documents" section in all topics
17 August 2016 11:24
On 17th August the second release of the "Questions & Answers" document was published on this call web site. It is available in the "Additional Documents" section in all topics.
The budget tables in the submission system have been updated for Innovation Actions to reflect the correct EU reimbursement rate. Previously the reimbursement rate was incorrectly the same 100% for all organisation types while under the Innovation Actions the funding rate is actually 70% with the exception of non-profit legal entities, where a rate of 100% applies.
09 August 2016 10:38
The budget tables in the submission system have been updated for Innovation Actions to reflect the correct EU reimbursement rate. Previously the reimbursement rate was incorrectly the same 100% for all organisation types while under the Innovation Actions the funding rate is actually 70% with the exception of non-profit legal entities, where a rate of 100% applies.
02 August 2016 20:51
The submission session is now available for: JTI-CS2-2016-CFP04-SYS-02-25(CS2-IA)
11 July 2016 12:46 The submission session is now available for: JTI-CS2-2016-CFP04-SYS-02-25(CS2-IA)
TOPIC : Innovative cooling system for embedded power electronics
| Topic identifier: | JTI-CS2-2016-CFP04-SYS-02-25 | ||
| Publication date: | 21 June 2016 | ||
| Types of action: | CS2-IA Innovation action | ||
| DeadlineModel: Planned opening date: |
single-stage 21 June 2016 |
Deadline: | 05 October 2016 17:00:00 |
| Time Zone : (Brussels time) | |||
Call identifier: H2020-CS2-CFP04-2016-02
Topic Description
Specific Challenge:
The next generation of power electronic module needs to be highly integrated to reduce the weight impact for the more electrical aircraft. If new technologies of power components such as SiC and GAN support higher temperature environment, these power components need to be cooled to maintain reliable operating temperatures. The challenge is to develop effective heat sinks that serve for extracting and transferring the dissipated power from the power semiconductors with removal of heat by means of air flow through the heat sink. For this application, the partner shall combine material with high thermal conductivity properties and optimized folded brazed fin heat sink solution. The evaluation of heat sink prototypes is expected as a stand-alone effort and also in a mechanical structure to represent a power management system integrating a few electronic modules equipped with the high efficiency heat sink technology.
Specific Challenge:
The next generation of power electronic module needs to be highly integrated to reduce the weight impact for the more electrical aircraft. If new technologies of power components such as SiC and GAN support higher temperature environment, these power components need to be cooled to maintain reliable operating temperatures. The challenge is to develop effective heat sinks that serve for extracting and transferring the dissipated power from the power semiconductors with removal of heat by means of air flow through the heat sink. For this application, the partner shall combine material with high thermal conductivity properties and optimized folded brazed fin heat sink solution. The evaluation of heat sink prototypes is expected as a stand-alone effort and also in a mechanical structure to represent a power management system integrating a few electronic modules equipped with the high efficiency heat sink technology.
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grant Background
About the Funding Agency
Horizon 2020 - is a Framework Programme for Research and Technological Development, and is created by the European Union in order to support and encourage research in the European Research Area (ERA). This is the biggest EU Research and Innovation programme ever with nearly €80 billion of funding available over 7 years (2014 to 2020). By coupling research and innovation, Horizon 2020 is helping to achieve this with its emphasis on excellent science, industrial leadership and tackling societal challenges. The goal is to ensure Europe produces world-class science, removes barriers to innovation and makes it easier for the public and private sectors to work together in delivering innovation. The Horizon 2020 programme running from 2014 to 2020 has a €79 billion budget (a 46% increase over FP7).
It is structured around three core pillars:
- Excellent Science (~€24.4bn)
- Industrial Leadership (~€17bn)
- Societal Challenges (~€29.7bn)
Type of projects: mostly grants, no supplies, no works.
In order to see Horizon 2020 opportunities on DevelopmentAid, please click here.
About the Sectors
Energy
Involves the production, transformation, transportation, and distribution of energy from renewable and non-renewable sources.
Key areas:
- Renewable and non-renewable energy production
- Energy infrastructure and distribution systems
- Power generation and energy supply solutions
Heating & Cooling systems
Involves systems and equipment used for heating, cooling, ventilation, and temperature control in buildings and facilities.
Key areas:
- Heating and cooling installations
- Heating, Ventilation, and Air Conditioning (HVAC) and ventilation systems
- Temperature control and refrigeration equipment
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