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FLFLASH INFORMATION ON THE CALL RESULTS (FLASH CALL INFO)
Call for proposals: Cloud Data and TEF
Call ID: DIGITAL-2021-CLOUD-AI-01
Published: 17/11/2021 Deadline: 22/02/2022
Total budget: 140.000.000 EUR
Budget per topic:
The Commission has now completed the evaluation of the proposals submitted to the above-mentioned call. The results by topic can be consulted under topic updates.
We recently informed the applicants about the evaluation results for their proposals.
It is expected that grant agreements will be signed by 22.11.2022.
Please note that the number of proposals that can finally be funded will depend on the finally available budget and the formal selection by the Commission.
Fo For further details please see the DIGITAL Europe Programme.
https://ec.europa.eu/info/funding-tenders/find-funding/eu-funding-programmes/digital-europe-programme_en
The evaluation results of topic DIGITAL-2021-CLOUD-AI-01-DATA-TECH are shown below:
Total budget requested for above-threshold proposals: 1.998.276,00 EUR
Secretariat for the Alliance on Processors and Semiconductor technologies
TOPIC ID: DIGITAL-2021-CLOUD-AI-01-DATA-TECH
Outcome and Deliverables
The Secretariat of the Industrial Alliance will support the European Commission in delivering on the following outcomes:
A platform for identifying opportunities for leveraging investment and innovation synergies in the research, development and deployment of next generation of resource-efficient, interoperable, highly secure semiconductor technologies. This platform should enhance coherence and synergies across activities in the IPCEIs, the KDT JU, Digital Europe Programme and the Pact for Skills.
The European Commission will be an observer to the General Assembly, monitoring progress with a view to its policy and investment agenda and act as a facilitator towards cooperation and engagement of all stakeholders, e.g. by providing secretarial services for the on-boarding of new members
Objective:This action is to support the activities of the Industrial Alliance on processors and semiconductor technologies that was announced in the Communication on “Updating the 2020 New Industrial Strategy” The purpose of the Alliance is to gather relevant stakeholders, including industry, Member States representatives and other experts, from across Europe in view of strengthening Europe’s industrial capacities in the design and manufacturing of advanced processors and other electronic components. The activities of the Alliance will contribute to delivering on the EU’s digital targets for 2030, by addressing use cases for all sectors of the economy, notably mobility, communications, industrial manufacturing, security, and health.
Scope:The main tasks of the Alliance will include: identification of critical gaps in the semiconductor value chain, development of targets and roadmaps, increasing design and manufacturing capacities and leveraging investment and innovation synergies. Member States representatives are invited to participate in the work of the Alliance in relevant working groups. This action consists in providing the following support services to the Alliance: