Partnership for Realization and Validation of AI Hardware Leadership: PREVAIL

Programme(s): Digital Europe Programme (DIGITAL)-DIGITAL-1

Topic(s): DIGITAL-2021-CLOUD-AI-01-TEF-EDGE

Type of action: DIGITAL Grants for Procurement

Project ID: 101083307

Objective:
The main objective of the PREVAIL project is to establish and start operating the core of a networked, multi-hub platform providing prototype chip fabrication capability, in advanced technology, to EU stakeholders for Artificial Intelligence (AI) applications. Four major European Research and Technology Organisations (RTOs) have set up this consortium to build on their advanced 300mm fabrication, design, and test facilities in a coordinated and complementary fashion to create a new multi-hub Test and Experimentation Facility for edge AI Hardware (TEF HW AI). This infrastructure will enable a trusted, non-discriminatory test facility in Europe capable of validating highperformance, low-power edge components and technologies to support the digital transformation. It will focus on the procurement, installation, and preparation of necessary equipment tools, on key digital functionalities: advanced non-volatile embedded memories (MRAM, OxRAM, FeRAM), 3D heterogeneous integration and assembling (die to die, die to wafer, wafer to wafer), integrated photonics and RF components and test, already develop by the partners. These will be brought to a level of maturity (TRL 6-7) to achieve an infrastructure capable of fabricating early prototype samples that could be tested in real edge AI applications. To reach this target it is necessary to freeze parts of the process flow in a more stable and statistically monitored infrastructure, lower the number of bottlenecks and the sources of yield detraction and enlarge the testing capabilities. Within the available budget and in discussion with early adopters in industry, PREVAIL will invest selectively to complement and strengthen the available capacity and capability to surmount the most essential limiting factors for each proposed technology. After the execution of PREVAIL project, the TEF will be ideally placed to be integrated with other open offers and chip IP design activities to further extend its scope.