European Space Agency

Space Evaluation of Chip-on-board Assembly for Non-hermetic Applications - Expro Plus

Last update: Dec 19, 2024 Last update: Dec 19, 2024

Details

Location:France
France
Category:Consulting services
Status:Open
Sectors:Science & Innovation, Air & Aviation
Languages:English
Funding Agency:
Contracting authority type:Development Institution
Eligibility:Organisation
Budget:N/A
Date posted: Oct 21, 2024

Attachments 2

Associated Awards

Project cycle timeline

STAGES
EARLY INTELLIGENCE
PROCUREMENT
IMPLEMENTATION
Cancelled
Status
Programming
Formulation
Approval
Forecast
Open
Closed
Shortlisted
Awarded
Evaluation

Quick summary

Objectives: The objective of this activity is to develop and to conduct a verification on materials and processes related to the assembly of chip-on-board for non-hermetic applications. The focus is to select the right combination of materials and assembly processes and test them in a space environment verification campaign.
Eligibility criteria: Materials and substrates must be assessed and selected according to their suitability for space applications. Initial ...

Description

Space evaluation of chip-on-board assembly for non-hermetic applications - expro plus Tender Action Number: 1-12582
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