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European Commission Directorate-General for International Partnerships (EuropeAid HQ)

Flip-chip bonder

Last update: Aug 27, 2024 Last update: Aug 27, 2024

Details

Location:FinlandFinland
Category:Goods
Status:Open
Sectors:Laboratory & Measurement
Languages:English
Contracting Authority: Tampere University (Tampereen Korkeakoulusaatio SR)
Funding Agency:
European Commission Directorate-General for International Partnerships (EuropeAid HQ)
Contracting Authority Type:Government / Public Sector
Eligibility:Organisation
Budget:N/A
Date posted: Aug 26, 2024

Attachments • 2

Associated Awards

Project cycle timeline

STAGES
EARLY INTELLIGENCE
PROCUREMENT
IMPLEMENTATION
Cancelled
Status
Programming
Formulation
Approval
Forecast
Open
Closed
Shortlisted
Awarded
Evaluation

Associated tenders • 0

Status

Date

Description

Title: Flip-chip bonder Internal identifier: TAU/4783/2024
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